First integrated circuits

The 50th anniversary of the official date is dedicated

B. Malashevich

On September 12, 1958, Texas Instruments (TI) Jack Keelby demonstrated three strange instruments to the leadership - glued with bee wax on a glass substrate of a device of two silicon slices measuring 11.1? 1.6 mm (Fig. 1). These were volumetric layouts - the prototypes of the integrated circuit (IP) of the generator, proving the possibility of manufacturing all elements of the scheme based on a single semiconductor material. This date is noted in the history of electronics as the birthday of integrated circuits. But is it?

Fig. 1. Layout of the first is J. Kilby. Photos from http://www.comoputerhistory.org/semiconductor/timeline/1958-miniaturized.html

By the end of the 1950s, the technology of the collection of radio-electronic equipment (REA) from discrete elements has exhausted its capabilities. The world came to an acute crisis of REA, demanded radical measures. At this point in the US and the USSR, integrated production technologies such as semiconductor devices and thick and thin-film ceramic boards have already been industrially mastered, i.e. the prerequisites for exiting this crisis by creating multi-element standard products - integrated circuits.

The integrated circuits (microcircuits, IP) include electronic devices of various complexity, in which all the same elements are manufactured simultaneously in a single technological cycle, i.e. By integral technology. Unlike printed circuit boards (in which in a single cycle on the integral technology, all connecting conductors are simultaneously manufactured) and resistors, and capacitors, and (in semiconductor IP) diodes and transistors are formed. In addition, a lot of IP is manufactured at the same time, from dozens, up to thousands.

IP are developed and manufactured by the industry in the form of a series that combines a number of microcircuits of various functional purposes intended for joint use in electronic equipment. IC series have standard design and unified system of electrical and other characteristics. IP are supplied by a producer of various consumers as independent commodity products that satisfy a specific system of standardized requirements. Exercise is related to non-processed products, when repairing Raa, IP has become replaced.

There are two basic groups of IP: hybrid and semiconductor.

In the hybrid IS (GIS) on the surface of the chipset (as a rule, from ceramics), all conductors and passive elements are formed by integrated technology. The active elements in the form of inapproprous diodes, transistors and semiconductor crystals are installed on the substrate individually, manually or automata.

In semiconductor, the connecting, passive and active elements are formed in a single technological cycle on the surface of the semiconductor material (usually silicon) with a partial invasion in its volume of diffusion methods. At the same time on one plate of the semiconductor, depending on the complexity of the device and the size of its crystal and plate, is made from several tens to several thousand IP. Industry semiconductor IP produces in standard housings, as separate crystals or in the form of unrelated plates.

The phenomenon of the world of hybrid (GIS) and semiconductor IP occurred in different ways. GIS is a product of the evolutionary development of micromodules and installation technology on ceramic fees. Therefore, they appeared unnoticed, the generally accepted date of birth of GIS and the generally accepted author does not exist. Semiconductor ICs were a natural and inevitable result of the development of semiconductor equipment, but requiring the generation of new ideas and the creation of new technology, which have their own birth dates, and their authors. The first hybrid and semiconductor ICs appeared in the USSR and the United States almost simultaneously and independently of each other.

First hybrid IS.

The hybrid includes IP, in the production of which combines the integral technology for the manufacture of passive elements with individual (manual or automated) technology of installation and installation of active elements.

Back in the late 1940s, Centralab in the United States developed the basic principles of manufacture of thick-film printed circuit boards on a ceramic basis, developed by other firms. The technologies for the manufacture of printed circuit boards and ceramic capacitors were found. From printed circuit boards, they took the integral technology for the formation of the topology of the connecting conductors - silk screen. From capacitors - substrate material (ceramics, more often), as well as materials of pastes and thermal technology for their fixing on the substrate.

And in the early 1950s, the RCA company invented the thin-film technology: spraying various materials in vacuum and precipitating them through a mask on special substrates, they learned on a single ceramic substrate simultaneously produce a plurality of miniature film connecting conductors, resistors and capacitors.

Compared to the thick-brain, thin-film technology provided the possibility of more accurate manufacture of elements of the topology of smaller sizes, but required more complex and expensive equipment. Devices manufactured on ceramic boards on thick-brain or thin-film technology were called "hybrid schemes". Hybrid schemes were produced as component products of their own production, their design, dimensions, functional purpose of each manufacturer were their own, they did not fall on the free market, and therefore they are little known.

The hybrid schemes and micromoduli invaded. At first they used discrete passive and active miniature elements combined by traditional printed installation. The technology of assembly was difficult, with a huge share of manual labor. Therefore, micromoduli were very expensive, their use was limited to onboard equipment. Then the thick-film miniature ceramic scarves applied. Next, the thick-hearty technology began to make resistors. But diodes and transistors were still discrete, individually corrupted.

The hybrid integrated circuit of the micromodule began at the moment when it was applied in it with inapproprous transistors and diodes and seal the design in a common case. This made it possible to significantly automate the process of their assembly, dramatically reduce prices and expand the scope of application. According to the method of the formation of passive elements, crowded and thin-film GIS distinguish.

First GIS in the USSR

The first GIS (quantum type modules later received the designation of the IC series 116) were developed in the USSR in 1963 in NIRE (later Leninet NGO, Leningrad) and in the same year his experienced plant began their mass production. In these GIS, semiconductor IP "P12- 2", developed in 1962, were used as active elements, developed in 1962 by the Riga plant of semiconductor devices. In connection with the continuity of the stories of creating these IP and their characteristics, we will consider them together in the section on P12-2.

Undoubtedly, the quantum modules were the first GIS in the world with two-level integration - non-discrete inapproprous transistors were used as active elements, and semiconductor IP. It is likely that they were generally the first in the world GIS - constructively and functionally completed multi-element products supplied by the consumer as independent commercial products. The earliest of the scientists identified by the author are below the described SLT -Modules of IBM corporation, but they were announced in the following, 1964

First GIS in the USA

The appearance of thick-brand GIS, as the main element base of the new computer IBM System / 360, was announced for the first time the IBM corporation in 1964 it seems that this was the first use of GIS outside the USSR, the author failed to find earlier examples.

Already known at the time in the circles of specialists semiconductor systems of the "MicroLogic" series Fairchild and SN -51 firms of TI (we will say about them below) were still unavailable rare and non-disabilities for commercial use, which was the construction of a big computer. Therefore, IBM, taking the design of a flat micromodule as a basis, developed its series of thick-free GIS, announced under the general title (as opposed to "micromodules") - "SLT -modules" (Solid Logic Technology - technology of solid logic. Usually the word "s olid" They are translated into Russian as "solid", which is absolutely illogical. Indeed, the term "SLT -module" was introduced by IBM as opposition to the term "micromodule" and should reflect their difference. But both modules are solid, that is, this translation is not It is suitable. The word "solid" has other meanings - "solid", "whole", which successfully emphasize the difference between "SLT -modules" and "micromodules" - SLT -Modules are indivisible, unrestreasonable, i.e. "whole". Therefore We used not a generally accepted translation into Russian: Solid Logic Technology - solid logic technology).

The SLT -Module was a square ceramic thick-grained microplate of a semiconductor with clicked vertical tide conclusions. It was applied to its surface with a silk-screening (according to the scheme of the device being implemented), connecting conductors and resistors, and unplanned transistors were installed. Condenses, if necessary, installed next to the SLT -module on the device board. With external almost identity (micromodules are slightly higher, Fig. 2.) SLT -Modules from flat micromodules were characterized by a higher layout density of elements, low power consumption, high speed and high reliability. In addition, SLT equipment is quite easily automated, therefore they could be released in huge quantities with a fairly low for use in the commercial equipment of the cost. This is this IBM and it was necessary. The company built for the production of SLT -modules an automated plant in East Fishkill near New York, which produced them with millions of circulation.

Fig. 2. Micromodule USSR and SLT module F. IBM. Photo STL from http://infolab.stanford.edu/pub/voy/museum/pictures/display/3-1.htm

Following IBM GIS began to produce other firms for which GIS became commodity products. The typical design of flat micromodules and SLT -modules of IBM corporation has become one of the standards for hybrid IP.

First semiconductor IS.

By the end of the 1950s, the industry had all the possibilities for the production of cheap elements of electronic equipment. But if transistors or diodes were manufactured from Germany and silicon, then resistors and capacitors were made from other materials. Many then believed that when creating hybrid schemes, there would be no problems in the assembly of these elements made separately. And if you manage to make all the elements of the sized size and shape and thereby automate the assembly process, the cost of the equipment will be significantly reduced. Based on such reasoning, supporters of the hybrid technology considered it as a general direction of the development of microelectronics.

But not everyone shared this opinion. The fact is that already created by the period of mesa-transistors and, especially planar transistors, were adapted for group processing, in which a number of operations for the manufacture of many transistors on a substrate plate were carried out simultaneously. That is, in one semiconductor plate, many transistors were made at once. The plate was then cut into separate transistors, which were placed in individual enclosures. And then the manufacturer of the instrument combined the transistors on the same printed circuit board. There were people who seemed to be ridiculous - why disconnect transistors, and then join them again. Can they unite them immediately on the semiconductor plate? At the same time get rid of several complex and expensive operations! These people came up with semiconductor IP.

The idea is extremely simple and completely obvious. But, as often happens, only after someone first announced it and proved. It was proved that it was simply announced, as in this case, it is not enough. The idea of \u200b\u200bIP was announced back in 1952, before the emergence of group methods for the manufacture of semiconductor devices. At the annual conference on electronic components held in Washington, an employee of the British royal radar management in Malvern Jeffrey Dammer presented a report on the reliability of the elements of radar equipment. In the report, he made a prophetic statement: " With the advent of transistor and work in the field of semiconductor equipment, it is generally possible to imagine electronic equipment in the form of a solid block that does not contain connective wires. The unit may consist of insulating layers, conducting, straightening and reinforcing materials, in which certain areas are cut out in such a way that they can directly perform electrical functions ". But this forecast remained experts unnoticed. They remembered only after the appearance of the first semiconductor IP, i.e., after practical evidence of the idea of \u200b\u200ba long time. Someone had to first formulate and implement the idea of \u200b\u200bsemiconductor IP.

As in the case of the transistor, the generally accepted creators of semiconductor IC had more or less successful predecessors. An attempt to realize his idea in 1956 was taken by Dummer himself, but failed. In 1953, Harvik Johnson from RCA received a patent for a one-chip generator, and in 1958, together with Torkell Vallmarke, announced the concept of a "semiconductor integral device". In 1956, the employee of the company Bell Labs Ross made a binary counter scheme based on N-P-N-P structures in a single single crystal. In 1957, Yasuro Tara from the Japanese company MITI received a patent for the combination of various transistors in one crystal. But all these and other similar developments had particular nature, were not brought to production and did not become the basis for the development of integral electronics. The development of IP in industrial production was facilitated by only three projects.

The already mentioned Jack Kilby from Texas Instruments (TI), Robert Neus from Fairchild (both of the USA) and Yuri Valentinovich Oskin from the KB of the Riga plant of semiconductor devices (USSR). Americans have created experimental samples of integrated circuits: J. Kilbi - Mock of Generator IC (1958), and then trigger on Mesa-Transistors (1961), R. Neuss - Trigger on planar technology (1961), and Yu. Osokin - a logical IC "2No-or" in Germany (1962) immediately deployed into mass production. Serial production of IP These firms began almost simultaneously, in 1962

First semiconductor IP in the USA

IS Jack Kilby. IP series " SN - 51 "

In 1958, J. Kilby (the pioneer of the use of transistors in hearing aids) moved to Texas Instruments. The newcomer Kilby, as a circuitry, "threw" to the improvement of the micromodule rocket filling by creating an alternative to micromodules. The option of assembling blocks from the details of a standard form, similar to the assembly of toy models from LEGO figurines is considered. About Dako Kilby became interested in other. The decisive role was played by the effect of "fresh look": first, he immediately stated that micromoduli was a dead end, and secondly, in love with mesa structures, came to the thought that the scheme needed (and can) be implemented from one material - semiconductor. Kilby knew about the idea of \u200b\u200bthe lammer and his unsuccessful attempt to implement it in 1956. After analyzing, he understood the reason for the failure and found a way to overcome it. " My merit is that taking this idea, I turned it into reality", J. Kilby said later in his Nobel speech.

Without earning more vacation rights, he worked without interference in the laboratory, while everyone rested. On July 24, 1958, Kilbi formulated the concept of "Monolith's" idea (Monolithic IDEA) in the laboratory magazine. Her essence was that. " .. The elements of the scheme, such as resistors, capacitors, distributed capacitors and transistors, can be integrated into one chip - provided that they will be made of one material ... In the design of the trigger scheme, all elements must be made of silicon, and resistors will be Use the volumetric resistance of silicon, and capacitors - PN transitions". The "idea of \u200b\u200bmonolith" met a condescending and ironic attitude from the leadership of Texas Instruments, which required evidence of the possibility of manufacturing transistors, resistors and condensers from a semiconductor and a performance collected from such elements of the scheme.

In September 1958, Kilbi implemented his idea - made an alternator from the beeted waxing on a glass substrate of two pieces of germanium with a size of 11.1 x 1.6 mm containing the diffusion regions of the two types (Fig. 1). These areas and having had contacts it used to create a generator scheme, connecting elements with thin gold wires with a diameter of 100 μm by thermocompression welding. From one region, a mesatransistor was created, from the other - RC chain. The collected three generators were demonstrated by the management of the company. When the power is connected, they earned at a frequency of 1.3 MHz. It happened on September 12, 1958. After a week, Kilbi produced an amplifier. But these were not yet integrated structures, these were the volumetric layouts of semiconductor IP, proving the idea of \u200b\u200bmaking all the elements of the scheme from one material - semiconductor.

Fig. 3. Type 502 J. Kilby trigger. Photos from http://www.comoputerhistory.org/semiconductor/timeline/1958-miniaturized.html

The first is really an integrated circuit of kilby, made in one piece of monolithic Germany, was the experimental IC of the Type 502 trigger (Fig. 3). It also uses the volumetric resistance of Germany, and the capacity of the P-N transition. Her presentation took place in March 1959. A small amount of such IP was manufactured in laboratory and was sold in a narrow circle at a price of $ 450. IC contained six elements: four mesa-transistors and two resistors placed on a silicon plate with a diameter of 1 cm. But Kilbi was a serious disadvantage - mesa-transistors, which in the form of microscopic "active" columns rumped over the rest, "passive" part of the crystal. The mesa-column connection with each other in Kilby was made by the tawishing of thin gold wires - haired all "hairy technology". It became clear that with such interconnections a chip with a large number of items not to do - a wire splash will break or reboots. And Germanium at that time was already considered as a material not promising. The breakthrough did not take place.

By this time, Planar silicon technology was developed in Fairchild. Given all this, Texas Instruments had to postpone everything made by Kilby on the side and begin, without Kilbi, to the development of the IP series based on planar silicon technology. In October 1961, the company announced the creation of the SN -51 IP series, and since 1962 their mass production and supply in the interests of the US Defense and NASA began.

I was Robert Neuss. IP series "Micrologic”

In 1957, for a number of reasons from W. Shockli, the inventor of a plane transistor, a group of eight young engineers who wanted to try to realize their own ideas. "The eight of the traitors", as Shockli called them, whose leaders were R. Neuss and Moore, founded Fairchild Semiconductor ("Beautiful Child"). He headed the company Robert Neuss, he was then 23 years old.

At the end of 1958, the physicist D. Horney, who worked at Fairchild Semiconductor, has developed a planar technology for manufacturing transistors. And the physicist of Czech origin Kurt Lehovk, who worked in Sprague Electric, developed the use of the use of back turned on N - P transition for electrical insulation of components. In 1959, Robert Neus, having heard about the layout of IS Kilby, decided to try to create an integral scheme, combining the processes proposed by Horney and Lehovec. And instead of the "hairy technology", Neuss intersects the selective spraying of a thin layer of metal on top of isolated silicon dioxide semiconductor structures with connecting elements through holes left in an insulating layer. This allowed "immersing" the active elements into the body of the semiconductor, isolating them with silicon oxides, and then combine these elements with sprayed aluminum or gold tracks, which are created using photolithography, metallization and etching processes at the last stage of manufacturing products. Thus, a really "monolithic" option was obtained to combine components into a single scheme, and the new technology was called "planar". But at first it was necessary to check the idea.

Fig. 4. Experimental trigger R. Neys. Photos from the site http://www.comoputerhistory.org/semiconductor/timeline/1960-firstic.html

Fig. 5. Photo of Micrologic I was in Life magazine. Photos from the site http://www.comoputerhistory.org/semiconductor/timeline/1960-firstic.html

In August 1959, R. Neuss instructed Joeh Lasta to work out an IP version on planar technology. First, like Kilbi, made a mock of a trigger on several silicon crystals, on which 4 transistors and 5 resistors were made. Then on May 26, 1960, the first one-chip trigger was made. For the insulation of the elements in it from the reverse side of the silicon plate, deep grooves filled with epoxy resin were etched. On September 27, 1960, a third version of the trigger was made (Fig. 4), in which the elements were isolated back turned on P - n with the transition.

FAIRCHILD SEMICONDUCTOR has been engaged only by transistors, scheme equipment for the creation of semiconductor IS have not had. Therefore, Robert Norman from Sperry Gyroscope was invited as a developer of the schemes. Norman was familiar with the resistor-transistor logic, which the company with its submission and chose as the basis of its future series of "MicroLogic", who has found its first application in the minitman rocket equipment. In March 1961, Fairchild announced the first experienced IC of this series (F -Trigger, containing six elements: four bipolar transistors and two resistors placed on a plate with a diameter of 1 cm.) With the publication of its photograph (Fig. 5) in the log Life. (dated March 10, 1961). Another 5 IP was announced in October. And from the beginning of 1962, Fairchild launched mass production of IP and supply them also in the interests of the US Department of Defense and NASA.

Kilbi and Neuis had to hear a lot of critical comments on their innovations. It was believed that the practical yield of suitable integrated circuits would be very low. It is clear that it should be lower than that of transistors (since it contains several transistors), which it was then no higher than 15%. Secondly, many have believed that in the integrated schemes are used unsuitable materials, since resistors and capacitors were not made from semiconductors. Thirdly, many could not perceive the idea of \u200b\u200bimpairment of IP. They seemed to be a blasphemous throw away the product, in which only one of many elements failed. All doubts were gradually discarded when integrated circuits were successfully used in US military and space programs.

One of the founders of Fairchild Semiconductor G. Mur has formulated the basic law of the development of silicon microelectronics, according to which the number of transistors in the integrated circuit crystal has doubled every year. This law, named "Moore Act", quite clearly acted during the first 15 years (since 1959), and then such a doubling took place approximately over a year and a half.

Next, the IP industry in the United States began to develop rapid pace. In the United States, an avalanche-like process of enterprises oriented exclusively "under the planar" began, sometimes reached the time that the top ten firms per week were registered. In an effort to veterans (firms of W. Shokley and R. Neys), as well as thanks to the tax breaks and the service represented by the University of Stenford, "newcomers" were cured mainly in the Santa Clara Valley (California). Therefore, it is not surprising that in 1971, a romantic-technogenic image of the Silicon Valley (Silicon Valley) entered the romantic-mangenic image of the Silicon Valley (Silicon Valley) in 1971 in 1971. By the way, in the terrain there really is a preferable to numerous apricot, cherry and plum gardens of the valley, having had something to appear in it, a more pleasant name - the Valley of Hearts (The Valley of Heart "s Delight), now, unfortunately, Forgotten.

In 1962, serial production of integrated circuits began in the United States, although their volume of supplies to customers was only a few thousand. The strongest incentive for the development of the instrument-making and electronics industry on a new basis was rocket-space technology. The United States then did not have the same powerful intercontinental ballistic missiles as Soviet, and to increase the charge were forced to go for the maximum reduction in the mass of the carrier, including management systems, due to the introduction of the latest electronic technology achievements. Texas Instrument and Fairchild Semiconductor entered into major contracts for the development and manufacture of integrated circuits with the US Department of Defense and NASA.

The first semiconductor IP in the USSR

By the end of the 1950s, the Soviet industry needed semiconductor diodes and transistors so much that radical measures were required. In 1959, plants of semiconductor devices were founded in Aleksandrov, Bryansk, Voronezh, Riga, etc. In January 1961, the Central Committee of the CPSU and the Council of the USSR adopted the next decree "on the development of the semiconductor industry", which provided for the construction of factories and research institutes in Kiev, Minsk, Yerevan, Nalchik and other cities.

We will be interested in one of their new plants - the above-mentioned Riga plant of semiconductor devices (RPPP, he changed his name several times, for simplicity we use the most famous, acting and now). As the starting site, the new plant was allocated to the building of a cooperative technical school area of \u200b\u200b5300 m 2, at the same time the construction of a special building began. By February 1960, 32 services were already created at the factory, 11 laboratories and experienced production, which began in April to prepare the production of first devices. The plant already worked 350 people, 260 of which during the year were sent to study in Moscow NII-35 (later the Research Institute of Pulsar) and the Leningrad Plant "Svetlana". And by the end of 1960, the number of employees reached 1900. Initially, the technological lines were posted in the rebuilt sports hall of the Cooperative Technical School building, and the Laboratory of the OKB - in the former learning audiences. The first devices (all-diffusion and conversion Germany transistors P-401, P-403, P-601 and P-602 development of the NII-35) released 9 months after signing the order of its creation, in March 1960. And by the end of July, the first thousand transistors P-401 was manufactured. Then mastered in production many other transistors and diodes. In June 1961, the construction of a special building was completed, in which mass production of semiconductor devices began.

Since 1961, the plant has begun independent technological and experimental work, including on mechanization and automation of production of transistors based on photolithography. For this, the first domestic photocurity (PhotosTamP) was developed - the installation of alignment and contact photo printing (developer A.S. Gotman). Midradioprom enterprises, including KB-1 (later NGO "Almaz", Moscow) and NIRE, provided great help in financing and manufacturing unique equipment. Then the most active developers of small-sized radio equipment, without having its technological semiconductor base, were looking for ways of creative interaction with newly created semiconductor plants.

An active work was carried out on the automation of the production of Germany transistors of type P401 and P403 based on the "Ausma" technological line created by the plant. Its chief designer (GK) A.S. Gotman suggested to do on the surface of Germany to the current paths from the transistor electrodes to the periphery of the crystal, so that it is easier to weld the contest conclusions in the housing. But the main thing, these tracks could be used as the external conclusions of the transistor when they are inappropriately assembling them on the fees (containing connecting and passive elements), soldering them directly to the corresponding contact sites (actually there was a technology for creating hybrid IP). The proposed method at which there is a crystal circuit breakers as if kissing with contact pads of the board, received the original name - "Kiss Technology". But due to a number of technological problems that have been inspired, mainly related to the problems of the accuracy of obtaining contacts on the printed circuit board, almost implement the "kiss technology" failed. In a few years, such an idea was implemented in the USA and the USSR and was widely used in the so-called "ball conclusions" and in the technology "chip-free".

Nevertheless, the hardware companies collaborating with RSPP, including NIRE, hoped on the "kiss technology" and planned its application. In the spring of 1962, when it became clear that its implementation was postponed for an indefinite period, Chief Engineer Niire V.I. Smirnov asked director of RZPP S.A. Bergman find another way to implement a multi-element scheme type 2NE-or, universal to build digital devices.

Fig. 7. Equivalent scheme of IP P12-2 (1LB021). Figure from IP prospectus from 1965

The first IP and GIS Yuri Osokina. Solid scheme P12-2 (IP Series 102 and 116 )

The director of RSPP instructed this task to young engineer Yuri Valentinovich Osokine. The department was organized in the composition of the technological laboratory, the laboratory for the development and manufacture of photoshoplands, the measuring laboratory and the experimental production line. At that time, the technology of manufacturing Germany diodes and transistors was delivered to the RPPP, and they were taken as the basis of the new development. And in the fall of 1962, the first prototypes of germanium solid scheme 2 should be obtained (since the term IP did not exist then, out of respect for those days, the name "solid scheme" - Tc), which received the factory notation "P12- 2". The advertising booklet of 1965 was preserved on P12-2 (Fig. 6), information and illustrations from which we will use. TC P12-2 contained two Germany P - n - P-transistor (modified transistors of type P401 and P403) with a total load in the form of a distributed Germanic resistor R-type (Fig. 7).

Fig. 8. Structure of IP P12-2. Figure from IP prospectus from 1965

Fig. 9. Overall drawing of TC P12-2. Figure from IP prospectus from 1965

External conclusions are formed by thermal compression welding between Germany regions of the structure of structure and gold output conductors. This ensures sustainable operations of the schemes with external influences in the conditions of tropics and marine fog, which is especially important for work in naval quasi-electron PBX, manufactured by the WEF Riga Plant, as well as interested in this development.

Constructively TC P12-2 (and the subsequent P12-5) were made in the form of "tablets" (Fig. 9) from a round metal cup with a diameter of 3 mm and a height of 0.8 mm. It was placed in her Crystal TC and flooded with a polymer compound, from which the short outer ends of the conclusions from the soft gold wire with a diameter of 50 μm were welded to crystal. The mass of P12-2 did not exceed 25 mg. In such performance, the vehicle was resistant to the effects of relative humidity of 80% at ambient temperature of 40 ° C and to cyclic changes in temperature from -60 ° to 60 ° C.

By the end of 1962, the experimental production of RSPP issued about 5 thousand TS P12-2, and in 1963 there were several tens of thousands. Thus, 1962 was the year of the birth of the microelectronic industry in the United States and the USSR.

Fig. 10. Groups TC P12-2

Fig. 11. Basic electrical characteristics P12-2

The semiconductor technology was then at the formation stage and did not yet guarantee the strict repeatability of the parameters. Therefore, workable devices were sorted by groups of parameters (this is often done in our time). Altered both Riganes, setting 8 TC P12-2 (Fig. 10). All other electrical and other characteristics in all typomynologists are the same (Fig. 11).

The release of TC P12-2 began simultaneously with the "Hardness" OCP, which ended in 1964 (GK Yu.V. Oskin). Within the framework of this work, an improved group technology of serial production of Germany vehicles based on photolithography and galvanic precipitation of alloys through a photomascular was developed. Its basic technical solutions are registered as the invention of Oskina Yu.V. and Mikhalovich D.L. (A.S. №36845). In the "Secret" journal published with the vulture of the "Secret" journal "Specradioelectronics" several articles Y.V. Osokina in collaboration with specialists KB-1 I.V. Nothing, G.G. Smolko and Yu.E. Naumov with a description of the design and characteristics of the TC P12-2 (and the TC P12-5 followed).

The structure of P12-2 was good to everyone, except for one - consumers could not use such small products with the finest conclusions. Neither technology nor equipment for this in hardware firms, as a rule, was not. For all the time of release P12-2 and P12-5, their use was mastered by NIIRE, the Zhigulevsky radios of Midradioproma, WEF, NIP (since 1978 NGO "Radio Corporation") and few other enterprises. Understanding the problem, the developers of the vehicle, together with NIRE, immediately thought out the second level of the structure, which simultaneously increased the layout density of the equipment.

Fig. 12. Module of 4 TC P12-2

B1963 in NIRE in the framework of the Kvantio (GK A.N. Pelipenko, with the participation of E.M. Lyakhovich) a module design was developed, in which four TC P12-2 were combined (Fig. 12). On a thin glass microplate was placed from two to four TC P12-2 (in the housing), implementing a certain functional node in the aggregate. At the board, it was closed to 17 conclusions (the number changed for a specific module) 4 mm long. The microplate was placed in a metallic stamped cup of 21.6 sizes? 6.6 mm and a depth of 3.1 mm and poured with a polymer compound. The result was a hybrid integrated circuit (GIS) with double sealing elements. And, as we said, it was the first GIS world with two-level integration, and perhaps the first GIS. Eight types of modules have been developed with a common quantum name, which performed various logical functions. As part of such modules, TC P12-2 retained performance when exposed to constant accelerations up to 150 g and vibratory loads in the frequency range of 5-2000 Hz with acceleration to 15 g.

The "Kvant" modules first released the experienced production of NIRE, and then they were transferred to the Zhigulevsky radios of the Ministry of Industry of the USSR, which supplied them to various consumers, including the WEF plant.

The TC P12-2 and the Kvant modules on their basis have proven themselves and are widely used. In 1968, a standard that establishes a single system of designations of integrated circuits, and in 1969 - general technical conditions for semiconductor (NP0.073.004TU) and hybrid (NP0.073.003T) is with a single system of requirements. In accordance with these requirements in the Central Bureau for the application of integrated circuits (TSBPIMS, later the CKB "Dayton", Zelenograd) On February 6, 1969, new technical conditions for the TC3.369.001-1TU were approved for the vehicle. At the same time, the term "integrated circuit" of the series 102. TS P12-2 was first appeared in the designation of the product: 1LB021V, 1LB021G, 1LB021Z, 1LB021I. In fact, it was one IP, sorted into four groups on output voltage and load capacity.

Fig. 13. IC series 116 and 117

And on September 19, 1970, the technical conditions of AV0.3088.014U were approved in the TSBPIMS on the "Kvant" modules, which received the designation of the IC 116 (Fig. 13). The series included nine ICs: 1xl161, 1xl162 and 1xl163 - multifunctional digital circuits; 1 liter161 and 1 liters162 - two and four logical elements 2No-or; 1Tro161 and 1TR1162 - one and two trigger; 1UP161 - Power amplifier, as well as 1LP161 - Logical element "Ban" for 4 inputs and 4 outputs. Each of them of these IPs had from four to seven versions of execution, characterized by voltage of output signals and load capacity, there were 58 test data. The execution was marked with the letter after the digital part of the IP designation, for example, 1xl161zh. In the future, the nomenclature of the modules expanded. IC series 116 were actually hybrid, but at the request of the RPPP were labeled as semiconductor (first digit in the designation - "1", hybrid should be "2").

In 1972, the joint decision of the Ministry of Elektromprom and the Ministryradioproome, the production of modules was transferred from the Zhigulevsky radiospace on the RPPP. This eliminated the transportation of the IC of the series 102 for long distances, so they abandoned the sealing of the crystal of each IP. As a result, the design of the IP and the 102nd, and the 116th series were simplified: the need to build an IC series 102 into a metal cup with fill with compound. Effective ICs of the series 102 in the technological container were entered into the adjacent workshop to assemble the IC of the 116, they were mounted directly on their microplate and sealed in the module housing.

In the mid-1970s, a new standard was released on the IP designation system. After that, for example, IC 1LB021V received the designation 102LB1V.

Second IP and GIS Yuri Osokina. Solid scheme P12-5 (IP Series 103 and 117 )

By the beginning of 1963, as a result of serious work on the development of high-frequency N - P - N transistors, Collective Yu.V. Osokina has accumulated extensive experience with P-slot on the original N-carmanic plate. This and the presence of all the necessary technological components allowed Okokin in 1963 to begin the development of a new technology and the design of a faster version of the vehicle. In 1964, by order of NIIRE, the development of TC P12-5 and modules on its basis was completed. According to its results in 1965, OCP "Palanga" was opened (GK Yu.V. Oskin, his deputy - D.L. Mikhalovich was completed in 1966). Modules based on P12-5 in the framework of the same Kvant OC, as the modules on P12-2. Simultaneously with the technical conditions on the series 102 and 116, the technical conditions of the branch of the series 103 (P12-5) were approved on the IC of the 103 (P12-5) and AV0.308.016U on the IC 117 (modules based on IC 103). The nomenclature of types and typosal systems of the TC P12-2, modules on them and the series of IP 102 and 116 were identical to the Nomenclature of TC P12-5 and IC of Series 103 and 117, respectively. They differed only by the speed and technology for manufacturing the IP crystal. The typical time delay delay signal of the series 117 was 55 ns against 200 ns in the 116 series.

Constructively TC P12-5 was a four-layer semiconductor structure (Fig. 14), where the substrate N -type and Emmithers P + -Tip were connected to the total tire of "land". The main technical solutions for the construction of the TC P12-5 are recorded as the invention of Oskina Yu.V., Mikhalovich D.L. Kaidalova J.A. and Akmemina Ya.P. (A.S. №248847). In the manufacture of a four-layer structure of the TC P12-5, an important know-how was the formation in the source Germany plate N -Tip P -Clow. This was achieved by a zinc diffusion in a quartz squanded ampoule, where the plates are located at a temperature of about 900 ° C, and zinc - in the other end of the ampule at a temperature of about 500 ° C. Further formation of the structure of the vehicle in the created P is similar to the TC P12-2. New technology made it possible to escape from the complex shape of the CS crystal. The plates with p12-5 were also grinding from the back to a thickness of about 150 μm while maintaining a part of the source plate, then they were scrupled into separate rectangular IP crystals.

Fig. 14. The structure of the crystal TC P12-5 from the AC No. 248847. 1 and 2 - Earth, 3 and 4 - Inputs, 5 - Exit, 6 - Food

After the first positive results of the manufacture of experimental TC P12-5, on request KB-1, Nir "Meson-2" was opened, aimed at creating a vehicle with four P12-5. In 1965, active samples were obtained in a flat metal ceramic case. But P12-5 turned out to be complex in production, mainly due to the complexity of the formation of a doped with zinc P-slot on the original N - GE plate. The crystal was time consumed in the manufacture, the percentage of suitable is low, the cost of TC is high. For the same reasons, TC P12-5 was produced in small volumes and to displace the slower, but the technological P12-2 was not able. And Nir "Meson-2" did not receive continuation at all, including due to the problems of interconnections.

By this time, the Research Institute "Pulsar" and in NIIME was already a wide front of work on the development of planar silicon technology, which has a number of advantages over Germany, main of which is a higher range of operating temperatures (+ 150 ° C in silicon and + 70 ° C Germany) and the presence of a natural protective film SiO 2 in silicon. And the RPP specialization was reoriented to the creation of analog IP. Therefore, RZPP specialists considered the development of Germany technology for the production of IP inexped. However, in the production of transistors and diodes, Germanium did not give up its position for some time. In the department of Yu.V. Osokina already after 1966 were developed and produced RZPP Germany planar low-noise microwave transistors GT329, GT341, GT 383 and others. Their creation was noted by the State Prize of the Latvian USSR.

Application

Fig. 15. Arithmetic device on solid modules. Photo from the booklet TC from 1965

Fig. 16. Comparative dimensions of the PBX control devices performed on the relay and the vehicle. Photo from the booklet TC from 1965

Customers and first consumers TC R12-2 and modules were the creators of specific systems: a "GNOM" computer (Fig. 15) for the onboard aircraft system "Dome" (NIRE, GK Lyakhovich E.M.) and naval and civilian PBXs (factory WEF, GK Missulovin L.Ya.). Actively participated at all stages of the creation of TS P12-2, P12-5 and modules on their and KB-1, the main curator of this cooperation from KB-1 was N.A. Barkanov. Help financing, manufacturing equipment, TC and modules in various modes and operating conditions.

TC R12-2 and Kvant modules based on it were the first chips in the country. Yes, and in the world they were among the first - only in the United States began to produce their first semiconductors of TEXAS INSTRUMENTS and Fairchild Semiconductor, and in 1964, IBM began the release of thick-film hybrid IS for his computer. In other countries, I have not thought about IP. Therefore, the integrated schemes for the public were a wonder, the effectiveness of their application produced a striking impression and beaten in advertising. In the preserved booklet on the TC R12-2 from 1965 (based on real applications) it is said: " The use of solid R12-2 schemes in onboard computers allows 10-20 times to reduce the weight and dimensions of these devices, reduce the power consumed and increase the reliability of operation. ... The use of solid R12-2 schemes in the management and switching systems of the PBX information paths allows to reduce the volume of control devices by about 300 times, and also significantly reduce electricity consumption (at 30--50 times) ". These statements were illustrated by photographs of the arithmetic device with the "GNOM" computer (Fig. 15) and the comparison of the PBF rack produced by the Relay with a small block on the palm of the girl (Fig.16). There were other numerous applications of the first Riga IP.

Production

It is now difficult to restore the full picture of the production volumes of the IP of the series 102 and 103 by year (today RSPP from a large plant has become a small production and many of the archives are lost). But according to the memories of Yu.V. Osokina, in the second half of the 1960s, production was calculated by many hundreds of thousands a year, in the 1970s - millions. According to the preserved personal recordings in 1985, IC series 102 was released - 4 100,000 pcs., 116 series modules - 1,025,000 pcs., IP series 103 - 700,000 pcs, 117 series modules - 175,000 pcs.

At the end of 1989, Yu.V. Oskin, then the Director General of Alpha, addressed the leadership of the military-industrial commission at the CM of the USSR (MCC) with a request to remove the series 102, 103, 116 and 117 due to their moral aging and high time consideration (25 years of microelectronics far Gone forward), but received a categorical refusal. Deputy Chairman of the UCC VL Coblov told him that the aircraft flies reliably, the replacement is excluded. After the collapse of the USSR, the IC series 102, 103, 116 and 117 was produced before the mid-1990s, i.e. more than 30 years. AUM "GNOM" is still standing in the navigator cabin "Il- 76" and some other aircraft. "This is a supercomputer," our pilots are not lost when foreign colleagues are surprised by the unprecedented aggregate.

About priorities

Despite the fact that J. Kilbi and R. Neuss had predecessors, it was they recognized by the world public as inventors of the integrated circuit.

R. Kilby and J. Neuss through its firms filed applications for the issuance of a patent for the invention of the integrated circuit. Texas Instruments filed a patent application earlier, in February 1959, and Fairchild did it only in July of the same year. But the patent at number 2981877 was issued in April 1961 R. Neuis. J. Kilby sueded and only in June 1964 received his patent at number 3138743. Then there was a ten-year war of priorities, as a result of which friendship won ". Ultimately, the appellate court confirmed the claims of R. Neuss to the championship in technology, but he decided to consider J. Kilby by the creator of the first working chip. And Texas Instruments and Fairchild Semiconductor signed an agreement on cross-licensing technologies.

In the USSR, patenting of inventions by the authors, besides the hassle, insignificant permanent payout and moral satisfaction did not give, therefore, many of the inventions were not fulfilled at all. And Osokin also did not hurry. But for enterprises, the number of inventions was one of the indicators, so they still had to execute. Therefore, the copyright certificate of the USSR for №36845 for the invention TS P12-2 Y. Osokina and D. Mikhalovich received only on June 28, 1966.

And J. Kilby in 2000 for the invention was one of the laureates of the Nobel Prize. R. Neuss did not wait for world recognition, he died in 1990, and the Nobel Prize is not assigned to posthumously. What, in this case, is not quite fair, since the entire microelectronics went along the way, begun by R. Neuss. Neuss's authority among specialists was so high that he even got the nickname "the mayor of the Silicon Valley", since then was the most popular of scientists who worked in the part of California, which received the unofficial name Silicon Valley (V. Shokley called "Moses Silicon Valley") . And the path of J. Kilby ("hairy" Germany) turned out to be a dead end, and was not implemented even in his company. But life is not always valid.

The Nobel Prize was assigned to three scientists. Halifer was received by 77-year-old Jack Kilby, and the second half was divided between Academician of the Russian Academy of Sciences by Zhores Alferov and Professor of the University of California in Santa Barbara, an American of German origin of the Herbert Kremer, for the "development of semiconductor heterostructures used in high-speed optoelectronics."

Evaluating these works, the experts noted that "integrated schemes there is, of course, the opening of the century, which had the strongest influence on society and the world economy." For all forgotten J. Kilby, the award of the Nobel Prize turned out to be a surprise. In an interview journal Europhysics News. He admitted: " At that time, I only thought about what would be important for the development of electronics from the point of view of the economy. But I did not understand then that the decline in the cost of electronic products will cause an avalanche growth of electronic technologies ".

And the works of Y. Osokina are not appreciated not only by the Nobel Committee. They are forgotten in our country, the priority of the country in the creation of microelectronics is not protected. And he was undoubtedly.

In the 1950s, the material basis for the formation in one monolithic crystal or on a single ceramic substrate of multi-element products - integrated circuits was created. Therefore, it is not surprising that almost simultaneously the idea of \u200b\u200bIP independently arose in the heads of many specialists. And the efficiency of introducing a new idea depended on the technological capabilities of the author and the interest of the manufacturer, i.e. from the presence of the first consumer. In this regard, Y. Oskin was in a better position than its American colleagues. Kilby was a newcomer in Ti, he even had to prove the management of the company the principled possibility of implementing a monolithic scheme with the manufacture of its layout. The actual role of J. Kilbi in creating IP is coming down to re-education Ti leadership and in provocation by its layout R. Neuss to active actions. The invention of Kilby did not go into mass production. R. Neuss In his young and not yet hardened company, I went to the creation of a new planar technology, which really became the basis of the subsequent microelectronics, but the author did not immediately. In connection with the above, both of them and their firms had to spend a lot of strength and time for the practical implementation of their ideas on the construction of silent IP. Their first samples remained experimental, and other chips went into mass production, not even them developed. Unlike Kilbi and Neuss, which were far from production, Zavrodeanin Y. Oskin relied on industrially developed semiconductor RZPP technologies, and he had guaranteed consumers of the first TCs in the form of the initiator of the development of the NIRE and a nearby WEF plant that helped in this work. For these reasons, the first version of its TS immediately went to an experienced, smoothly switched to mass production, which continuously continued for more than 30 years. Thus, starting the development of the vehicle later, Kilby and Neys, Y. Oskin (not knowing about this competition) quickly caught up with them. And the works of Y. Osokina are not related to the works of Americans, the testimony of the absolute dissimilarity of its TS and solutions implemented in it on Kilbi and Necess chips. Manufacture of its TEXAS INSTRUMENTS (not the invention Kilby), Fairchild and RZPP began almost simultaneously in 1962. This gives the full right to consider Y. Osokina one of the inventors of the integrated circuit along with R. Neuss and more than J. Kilby, and the part of the Nobel Prize J. Kilbi would be fair to share with Yu. Osokin. As for the invention of the first GIS with two-level integration (and possibly GIS at all), here is the priority of A. Pelipenko from Niire is absolutely none.

Unfortunately, it was not possible to find TC samples and devices based on them necessary for museums. The author will be very grateful for such samples or their photos.

Name the first computing device. Aback calculator arithmometer Russian scores which idea put forward in the middle

19th century English mathematician Charles Babbage?

The idea of \u200b\u200bcreating a software controlled countable machine having an arithmetic device, a control device, as well as an input and printing device.

The idea of \u200b\u200bcreating a cell phone

The idea of \u200b\u200bcreating robots managed by a computer

What year and where was the first computer based on electronic lamps?

1945, USA

1944, England

1946, France

What basis were the third generation computers were created?

Integrated schemes

semiconductors

electronic lamps

superbound integrated circuits

What was the name of the first personal computer?

Name the central device of the computer.

CPU

System unit

Power Supply

Motherboard

The processor processes the information presented:

In a decimal number system

In English

In Russian

In engine language (in binary code)

To enter numeric and text information used

Keyboard

The scanner is used for ...

To enter images of images and text documents

For drawing on it a special handle

Moving the cursor on the monitor screen

Holographic images

10. What type of printer is advisable to use financial documents to print?

Matrix printer

Jet printer

Laser printer

What type of printer is advisable to use to print essays?

Matrix printer

Jet printer

Laser printer

What type of printer is advisable to use photos for printing?

Matrix printer

Jet printer

Laser printer

With non-compliance with the sanitary and hygienic requirements of the computer, the harmful effect on human health can be provided ...

Monitor on an electronic radiation tube

Monitor on liquid crystals

Plasma panels

When the computer is turned off, all information is erased from ...

Random access memory

Hard disk

Laser Disc

In which computer is stored in the computer?

External memory;

cPU;

Optical tracks have a smaller thickness and placed more tightly on ...

Digital Video Engine (DVD Disk)

Compact Disk (CD - disk)

Input devices enter ...

The output device includes ...

Keyboard, Mouse, Joystick, Light Feather, Scanner, Digital Camera, Microphone

Sound columns, monitor, printer, headphone

Hard disk, processor, memory modules, motherboard, floppy disk

The program is called ...

A computer program can manage the work of the computer if it is ...

In RAM

On a flexible disk

On hard disk

On CD - disk

Data is ...

The sequence of commands that computer performs during data processing

Information presented in digital form and processed on the computer

Data having a name and stored in long-term memory

File is ...

Text printed on a computer

Information presented in digital form and processed on the computer

Program or data having a name and stored in long-term memory

With rapid formatting of a flexible disk ...

Clear disk directory

All data is erased

Disc defragmentation is performed

Verification of the disc surface

With full formatting of a flexible disk ...

all data is erased

a complete check of the disk is performed.

clear disk directory

the disk becomes systemic

In a multi-level hierarchical file system ...

Files are stored in a system of nested folders.

Files are stored in a system that is a linear sequence

The history of the development of computing equipment:

1. Name the first computing device.
1) Abak
2) Calculator
3) arithmometer
4) Russian scores

2. What idea was put forward in the mid-19th century English mathematician Charles Babbage?
1) the idea of \u200b\u200bcreating a software controlled countable machine having an arithmetic device, a control device, as well as an input and printing device
2) the idea of \u200b\u200bcreating a cell phone
3) the idea of \u200b\u200bcreating robots managed by a computer
3. Name the first programmer computing machines.
1) hell lavley
2) Sergey Lebedev
3) Bill Gates
4) Sophia Kovalevskaya

4. In which year and where was the first computer based on electronic lamps?
1) 1945, USA
2) 1950, USSR
3) 1944, England
4) 1946, France

5. What basis were the third generation computer created?
1) integrated circuits
2) semiconductors
3) electronic lamps
4) super-high integrated circuits

6. What was the first personal computer called?
1) Apple II
2) IBM PC
3) dell.
4) Corvette
Computer device ......................... 15
1. Name the central device of the computer.
1) Processor
2) System Block
3) power supply
4) motherboard
2. How is the physical information in the computer recorded and transmitted?
1) figures;
2) using programs;
3) appears in the form of electrical signals.

3. The processor processes the information presented:
1) in the decimal number system
2) in English
3) in Russian
4) on the machine (in binary code)
4. To enter numeric and text information used
1) Keyboard
2) Mouse
3) Trekball
4) Handle
5. The most important characteristic of the input coordinate devices is the resolution, which is usually 500 DPI (Dot Per Inch - dots per inch (1 inch \u003d 2.54 cm)), which means ...
1) When moving mouse to one inch, the mouse pointer moves by 500 points
2) when moving the mouse by 500 points, the mouse pointer moves one inch
6. Scanner is used for ...
1) to enter images and text documents
2) for drawing on it a special handle
3) Moving the cursor on the monitor screen
4) getting holographic images
Information output devices ................. 21
1. What type of printer is appropriate to use financial documents for printing?
1) Matrix Printer
2) inkjet printer
3) Laser printer
2. What type of printer is advisable to use to print abstracts?
1) Matrix Printer
2) inkjet printer
3) Laser printer

1. What type of printer is advisable to use photos for printing?
1) Matrix Printer
2) inkjet printer
3) Laser printer
2. In case of non-compliance with the sanitary and hygienic requirements of the computer, the harmful effect on human health can be provided ...
1) Monitor on an electronic radiation tube
2) Monitor on liquid crystals
4) Plasma panels
3. A device that provides an entry and reading of information is called ...
1) Drive or Drive

4. When the computer is turned off, all the information is erased from ...
4) RAM
5) hard disk
6) Laser Disc
7) Diets
13. In which computer is stored for information?
1) external memory;
2) monitor;
3) processor;
2. Optical tracks have a smaller thickness and placed more tightly on ...
1) Digital Video Engine (DVD - Disk)
2) Compact Disk (CD - disk)
3) diskette
3. On which disc information is stored on concentric paths, on which the magnetized and non-vitrate sections alternate
1) on a diskette
2) on a compact disc
3) on DVD - disk

4. In the input devices included ...

1) Hard disk, processor, memory modules, motherboard, floppy disk
5. In the output device included ...
1) Keyboard, Mouse, Joystick, Light Feather, Scanner, Digital Camera, Microphone
2) Sound columns, monitor, printer, earphone
3) Hard disk, processor, memory modules, motherboard, floppy disk
6. The program is called ...

7. Computer program can manage the work of the computer if it is ...
1) in RAM
2) on a flexible disk
3) on hard disk
4) on CD - disk
8. Data is ...
1) The command sequence that the computer performs during the data processing process
2) information presented in digital form and processed on the computer
3) data having a name and stored in long-term memory
9. File is ...
1) text printed on a computer
2) information presented in digital form and processed on the computer
3) Program or data having a name and stored in long-term memory

10. With the rapid formatting of the flexible disk ...
1) Clean the disk directory is cleaned.
2) all data is erased
3) disk defragmentation
4) Check on

1. When and who was invented counting perforation machines? What tasks were solved on them?

2. What is an electromechanical relay? When was the relay computing machines created? What speed did they possess?
3. Where and when was the first computer built? What was it called?
4. What is the role of John von Neuman in creating a computer?
5. Who was the designer of the first domestic computer?
6. On which elementary database created the first generation machines? What were their main characteristics?
7. On which elementary database created the second generation machines? What are their advantages compared to the first generation of computer?
8. What is an integrated circuit? When were the first computers on integrated circuits? What were they called?
9. What are the new areas of application of the computer arose with the appearance of third-generation machines?

SBI

Modern integrated chips designed for surface mounting.

Soviet and foreign digital microcircuits.

Integral ENGL. INTEGRATED CIRCUIT, IC, Microcircuit, Microchip, Silicon Chip, OR CHIP), ( micro)scheme (IP, IS, M / CX), chip, microchip (eng. chip. - Slug, chip, chip) - a microelectronic device - an electronic circuit of arbitrary complexity, made on a semiconductor crystal (or film) and placed in an unintended body. Often under integrated circuit (IP) understand the actual crystal or film with an electronic circuit, and under microcham (MS) - ICs enclosed in the case. At the same time, the expression "chip component" means "components for surface mounting" in contrast to the components for the traditional soldering in the opening on the board. Therefore, it is more correct to say "chip chip", meaning a microcircuit for surface editing. Currently (year) Most of the microcircuits are manufactured in the housings for surface mounting.

History

The invention of the microcircuit began with the study of the properties of thin oxide films that appear in the effect of poor electrical conductivity at small electrical stresses. The problem was that in the place of contacting two metals did not occur electrical contact or he had polar properties. Deep studies of this phenomenon led to the discovery of diodes and later transistors and integrated circuits.

Design levels

• Physical - methods for implementing one transistor (or small group) in the form of doped zones on a crystal.
• Electric - conceptual electrical diagram (transistors, condensers, resistors, etc.).
• Logical - logical scheme (logical inverters, elements or non, and not, etc.).
• Schedural and systemotechnical level - circuit and systemotechnical schemes (triggers, comparators, encoders, decoders, aluminum, etc.).
• Topological - topological photosales for production.
• Program level (for microcontrollers and microprocessors) - assembler commands for a programmer.

Currently, most of the integrated circuits are developed using CAD, which allow you to automate and significantly accelerate the process of obtaining topological photos.

Classification

The degree of integration

Purpose

The integrated chip may have a complete, as complex, functional - up to a whole microcomputer (single-chip microcomputer).

Analog schemes

• Signal generators
• Analog multipliers
• Analog Attenuators and Adjustable Amplifiers
• Stabilizers of power sources
• Pulse Power Supply Control Microcircuits
• Signal converters
• Synchronization schemes
• Various sensors (temperatures, etc.)

Digital circuits

• Logic elements
• Buffer transducers
• Memory modules
• (Micro) processors (including CPUs in the computer)
• Solidary microcomputers
• FPGA - programmable logical integrated circuits

Digital integral chips have a number of advantages compared to analog:

• Reduced power consumption It is associated with the use of pulsed electrical signals in digital electronics. When receiving and converting such signals, active elements of electronic devices (transistors) operate in the "key" mode, that is, the transistor is either "open" - which corresponds to the high-level signal (1), or "closed" - (0), in the first case There is no voltage drop in the transistor, in the second - it does not go through it. In both cases, energy consumption is close to 0, unlike analog devices, in which most of the time transistors are in an intermediate (resistive) state.
• High noise immunity Digital devices are associated with a large difference of high signals (for example, 2.5 - 5 V) and low (0- 0.5 V) level. The error is possible with such interference when the high level is perceived as low and vice versa, which is probably not enough. In addition, in digital devices it is possible to apply special codes to correct errors.
• The great difference between high and low level signals and a fairly wide range of their permissible changes makes digital equipment insensitive By inevitable in the integrated technology, the variation of elements parameters, eliminates the need to select and configure digital devices.

Name the first computing device. Aback calculator arithmometer Russian scores which idea put forward in the middle

19th century English mathematician Charles Babbage?

The idea of \u200b\u200bcreating a software controlled countable machine having an arithmetic device, a control device, as well as an input and printing device.

The idea of \u200b\u200bcreating a cell phone

The idea of \u200b\u200bcreating robots managed by a computer

What year and where was the first computer based on electronic lamps?

1945, USA

1944, England

1946, France

What basis were the third generation computers were created?

Integrated schemes

semiconductors

electronic lamps

superbound integrated circuits

What was the name of the first personal computer?

Name the central device of the computer.

CPU

System unit

Power Supply

Motherboard

The processor processes the information presented:

In a decimal number system

In English

In Russian

In engine language (in binary code)

To enter numeric and text information used

Keyboard

The scanner is used for ...

To enter images of images and text documents

For drawing on it a special handle

Moving the cursor on the monitor screen

Holographic images

10. What type of printer is advisable to use financial documents to print?

Matrix printer

Jet printer

Laser printer

What type of printer is advisable to use to print essays?

Matrix printer

Jet printer

Laser printer

What type of printer is advisable to use photos for printing?

Matrix printer

Jet printer

Laser printer

With non-compliance with the sanitary and hygienic requirements of the computer, the harmful effect on human health can be provided ...

Monitor on an electronic radiation tube

Monitor on liquid crystals

Plasma panels

When the computer is turned off, all information is erased from ...

Random access memory

Hard disk

Laser Disc

In which computer is stored in the computer?

External memory;

cPU;

Optical tracks have a smaller thickness and placed more tightly on ...

Digital Video Engine (DVD Disk)

Compact Disk (CD - disk)

Input devices enter ...

The output device includes ...

Keyboard, Mouse, Joystick, Light Feather, Scanner, Digital Camera, Microphone

Sound columns, monitor, printer, headphone

Hard disk, processor, memory modules, motherboard, floppy disk

The program is called ...

A computer program can manage the work of the computer if it is ...

In RAM

On a flexible disk

On hard disk

On CD - disk

Data is ...

The sequence of commands that computer performs during data processing

Information presented in digital form and processed on the computer

Data having a name and stored in long-term memory

File is ...

Text printed on a computer

Information presented in digital form and processed on the computer

Program or data having a name and stored in long-term memory

With rapid formatting of a flexible disk ...

Clear disk directory

All data is erased

Disc defragmentation is performed

Verification of the disc surface

With full formatting of a flexible disk ...

all data is erased

a complete check of the disk is performed.

clear disk directory

the disk becomes systemic

In a multi-level hierarchical file system ...

Files are stored in a system of nested folders.

Files are stored in a system that is a linear sequence

The history of the development of computing equipment:

1. Name the first computing device.
1) Abak
2) Calculator
3) arithmometer
4) Russian scores

2. What idea was put forward in the mid-19th century English mathematician Charles Babbage?
1) the idea of \u200b\u200bcreating a software controlled countable machine having an arithmetic device, a control device, as well as an input and printing device
2) the idea of \u200b\u200bcreating a cell phone
3) the idea of \u200b\u200bcreating robots managed by a computer
3. Name the first programmer computing machines.
1) hell lavley
2) Sergey Lebedev
3) Bill Gates
4) Sophia Kovalevskaya

4. In which year and where was the first computer based on electronic lamps?
1) 1945, USA
2) 1950, USSR
3) 1944, England
4) 1946, France

5. What basis were the third generation computer created?
1) integrated circuits
2) semiconductors
3) electronic lamps
4) super-high integrated circuits

6. What was the first personal computer called?
1) Apple II
2) IBM PC
3) dell.
4) Corvette
Computer device ......................... 15
1. Name the central device of the computer.
1) Processor
2) System Block
3) power supply
4) motherboard
2. How is the physical information in the computer recorded and transmitted?
1) figures;
2) using programs;
3) appears in the form of electrical signals.

3. The processor processes the information presented:
1) in the decimal number system
2) in English
3) in Russian
4) on the machine (in binary code)
4. To enter numeric and text information used
1) Keyboard
2) Mouse
3) Trekball
4) Handle
5. The most important characteristic of the input coordinate devices is the resolution, which is usually 500 DPI (Dot Per Inch - dots per inch (1 inch \u003d 2.54 cm)), which means ...
1) When moving mouse to one inch, the mouse pointer moves by 500 points
2) when moving the mouse by 500 points, the mouse pointer moves one inch
6. Scanner is used for ...
1) to enter images and text documents
2) for drawing on it a special handle
3) Moving the cursor on the monitor screen
4) getting holographic images
Information output devices ................. 21
1. What type of printer is appropriate to use financial documents for printing?
1) Matrix Printer
2) inkjet printer
3) Laser printer
2. What type of printer is advisable to use to print abstracts?
1) Matrix Printer
2) inkjet printer
3) Laser printer

1. What type of printer is advisable to use photos for printing?
1) Matrix Printer
2) inkjet printer
3) Laser printer
2. In case of non-compliance with the sanitary and hygienic requirements of the computer, the harmful effect on human health can be provided ...
1) Monitor on an electronic radiation tube
2) Monitor on liquid crystals
4) Plasma panels
3. A device that provides an entry and reading of information is called ...
1) Drive or Drive

4. When the computer is turned off, all the information is erased from ...
4) RAM
5) hard disk
6) Laser Disc
7) Diets
13. In which computer is stored for information?
1) external memory;
2) monitor;
3) processor;
2. Optical tracks have a smaller thickness and placed more tightly on ...
1) Digital Video Engine (DVD - Disk)
2) Compact Disk (CD - disk)
3) diskette
3. On which disc information is stored on concentric paths, on which the magnetized and non-vitrate sections alternate
1) on a diskette
2) on a compact disc
3) on DVD - disk

4. In the input devices included ...

1) Hard disk, processor, memory modules, motherboard, floppy disk
5. In the output device included ...
1) Keyboard, Mouse, Joystick, Light Feather, Scanner, Digital Camera, Microphone
2) Sound columns, monitor, printer, earphone
3) Hard disk, processor, memory modules, motherboard, floppy disk
6. The program is called ...

7. Computer program can manage the work of the computer if it is ...
1) in RAM
2) on a flexible disk
3) on hard disk
4) on CD - disk
8. Data is ...
1) The command sequence that the computer performs during the data processing process
2) information presented in digital form and processed on the computer
3) data having a name and stored in long-term memory
9. File is ...
1) text printed on a computer
2) information presented in digital form and processed on the computer
3) Program or data having a name and stored in long-term memory

10. With the rapid formatting of the flexible disk ...
1) Clean the disk directory is cleaned.
2) all data is erased
3) disk defragmentation
4) Check on

1. When and who was invented counting perforation machines? What tasks were solved on them?

2. What is an electromechanical relay? When was the relay computing machines created? What speed did they possess?
3. Where and when was the first computer built? What was it called?
4. What is the role of John von Neuman in creating a computer?
5. Who was the designer of the first domestic computer?
6. On which elementary database created the first generation machines? What were their main characteristics?
7. On which elementary database created the second generation machines? What are their advantages compared to the first generation of computer?
8. What is an integrated circuit? When were the first computers on integrated circuits? What were they called?
9. What are the new areas of application of the computer arose with the appearance of third-generation machines?